840 Tie Point Solderless Breadboard with Mounting Holes, 165 × 56 × 8.5mm Capacitance Accuracy 50nF/500nF/5F/50F±1%±10

Capacitance Accuracy 50nF/500nF/5F/50F±1%±10

5 x 229 inches

CAN bus signal integrity

The backlight on the LCD provides convenience when operating in the dark and the auto power off feature helps preserve the battery

Logic Signal Output Module

840 Tie Point Solderless Breadboard with Mounting Holes, 165 × 56 × 8.5mm Capacitance Accuracy 50nF/500nF/5F/50F±1%±10Solderless breadboard ideal for testing, prototyping, and experimentation 840 tie points total: 200 in 2 power rails, 640 in a 64 10 matrix terminal strip Phosphor bronze spring clips with nickel plating. Accepts wires 21 to 26 AWG or pins of 0. 4 to 0. 7mm diameter. Measures 165 56 8. 5mm. ABS plastic construction with 6 mounting holes. Embossed legend. Great for building and testing new circuits because parts can be easily inserted and removed