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BGA-Bottom-13 H8/3026 778mm) package (DIP socket)

BGA-Bottom-13 H8/3026 778mm) package (DIP socket)The Dataman BGA Bottom 13 is the bottom board of BGA adapter for Flash devices with balls in matrix 13x8. Some adapters are programmer specific and we recommend checking the software for compatibility prior to ordering. Please see our BGA Adapter Selection Guide for more information.

SKU: 66916180233 · From southroadsurgery.com.au

4.8
USD125.00 USD168.00

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Description

778mm) package (DIP socket)

The Dataman DIL40/TQFP64 ZIF CC-1 is a device specific adapter for Chipcon CC1010 in TQFP64 (open socket)

The Dataman DIL40/QFP64-4 ZIF NEC-1 is a device specific adapter for NEC 78K/0 / 78K/0S Flash MCU family in LQFP64 package (open socket)

Mitsubishi / Renesas Technology M34508G4FP) (open socket)

The Dataman BGA-Bottom-19 is the bottom board of BGA adapter for Flash devices with balls in matrix 8x8

BGA-Bottom-13 H8/3026 778mm) package (DIP socket)The Dataman BGA Bottom 13 is the bottom board of BGA adapter for Flash devices with balls in matrix 13x8. Some adapters are programmer specific and we recommend checking the software for compatibility prior to ordering. Please see our BGA Adapter Selection Guide for more information.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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